| Our Products: |
Double-sided /Multi-layer PCB, High Frequency PCB with blind and buried vias |
| Base materials: |
FR4 /CEM-3/Aluminum based materia/Ceramic base material |
| Monthly Output: |
60000 ㎡ |
| Maximum process area: |
1800mm x 600mm |
| Board thickness: |
Inner core thinkness:0.15-1.5mm |
| Finished board thickness:0.20-6.0mm |
Copper foil thickness
of conductor: |
17-175um |
| Minimum Line Space: |
0.1mm (4 mil) |
| Minimum Line Width: |
0.1mm (4 mil) |
| Minimum hole size: |
0.2mm (8 mil) |
Precision of profile
dimension: |
±0.127mm |
| Surface treatment: |
HASL, Immersion gold, Plating Ni/Au, OSP, Immersion Tin |
| Lead times: |
3-4 days for samples, 6-8 days for batch |
